The AI hardware boom is putting increasing pressure on advanced semiconductor packaging, a manufacturing process that combines processors and memory into high-performance chip assemblies. Packaging capacity has become a crucial constraint even when the individual chips can be manufactured.
TSMC remains a leading supplier of high-end packaging technologies such as CoWoS, used by major AI chip designers. With demand rising, other manufacturers are investing in alternative methods, including panel-level packaging that could handle more components and reduce material waste.
Industry research forecasts capital spending on advanced packaging near $28 billion in 2026. For businesses building AI data centers, the ability to assemble chips at scale may be just as important as obtaining the silicon itself.
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